脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 183 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | super low power |
Shipping Method | tray |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
HY57V643220DSTP-55 | 6,358 | 2006+ | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
EM638325TS-5.5 | TSOP2(86) | 3.3 V | 183MHZ | 0 C~+70 C |
EM638325VF-3.5/4/5/5.5 | TSOP2(86) | 3.3 V | 183MHZ | 0 C~+70 C |
EM638325VF-5.5 | TSOP2(86) | 3.3 V | 183MHZ | 0 C~+70 C |
HY57V643220-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220BTC-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220BTC-55-A | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CLT-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CT-5.5 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CT-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CT-55,60 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |