脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
HY57V643220HGTC6 | 9,000 | 00+ | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
W986432DH-6-86 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W986432EH-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W986432HD-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2-IB6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2DH-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2EH-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2GH6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2IH-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2JH-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
W9864G2JH-6/TRAY | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |