脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 1st Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V643220HGT-6,7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220HGT-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220HGT-H | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220HGTP-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220LT-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643222DTP-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V64322BTC-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V64322CT-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V653220ATC-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V653220BATC-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |