HY57V653220TC-6
产品详情
| 脚位/封装 | TSOP2(86) |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 166 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Bit Organization | x32 |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 4 banks |
| Die Generation | 1st Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| EM638325TS6-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TS6-6G DC:2010 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TSA-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325TSS-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM638325VF-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V643220(C)6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V643220-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V6432200CT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V643220BATC-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V643220BCT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |