脚位/封装 | FBGA |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 125MHz, CL3 |
标准包装数量 | |
标准外箱 | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | normal |
Hynix Memory | HY |
Die Generation | 4th Gen. |
Power Consumption | normal |
Shipping Method | tray |