HY5V56FFP
产品详情
| 脚位/封装 | FBGA |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | commercial(0°C~70°C) |
| 速度 | 100MHz, CL2 |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |
| 脚位/封装 | FBGA |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | commercial(0°C~70°C) |
| 速度 | 100MHz, CL2 |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |