IS22ES08G-JCLA1
产品概述
图片仅供参考
| 制造商IC编号 | IS22ES08G-JCLA1 |
| 厂牌 | ISSI/矽成 |
| IC 类别 | FLASH-EMMC |
| IC代码 | 8GB EMMC |
| 共通IC编号 | IS22ES08G-JCLA1-TR |
产品详情
| 脚位/封装 | FBGA-153 |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | 200 MHZ |
| 标准包装数量 | 152 |
| 标准外箱 | |
| Density | 8G |
| Product Family | Automotive Managed NAND |
| Interface | eMMC 5.0 |
| Technology | ISSI eMMC with MLC NAND |
| Revision | First Generation |
| Issi Designator | IS |
| Options | Standard (Boot Partition size 2MB) |
供应链有货
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| MX52LM08A11XVI | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| MX52LM08A11XWI | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XA | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XA2 | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XAT | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XI | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XI1 | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XI1D | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XI1Q | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |
| SDINBDG4-8G-XI2 | FBGA-153 | 3.3 V | 200 MHZ | -40 C~+85 C |