脚位/封装 | TFBGA-24 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 2.3V-3.6V |
温度规格 | -40 C~+85 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Density | 256M |
Product Family | Single/Dual/Quad/QPI SPI DTR Options Available |
Lead Free Package | Lead-Free (Pb Free) and Halogen Free |
Special Options | Standard |
Issi Designator | IS25 |
Rev Control | D |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
S25FL256SAGBHBA00 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHBA03 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI20 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI200 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI201 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI203 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI210 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI213 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI300 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL256SAGBHI310 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |