K4H560438E-GCB3
产品概述
图片仅供参考
| 制造商IC编号 | K4H560438E-GCB3 |
| 厂牌 | SAMSUNG/三星 |
| IC 类别 | DDR1 SDRAM |
| IC代码 | 64MX4 DDR1 |
| 共通IC编号 | K4H560438EGCB30 |
产品详情
| 脚位/封装 | FBGA |
| 外包装 | |
| 无铅/环保 | 含铅 |
| 电压(伏) | 2.5 V |
| 温度规格 | 0 C~+85 C |
| 速度 | 166 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 64M |
| Bit Organization | x4 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Generation | 6th Generation |
| Power | Normal Power |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| K4H560438E-GCB3 | 4,000 | 索取报价 | |
| K4H560438E-GCB3 | 960 | 索取报价 | |
| K4H560438E-GCB3 | 11,500 | 2008+ | 索取报价 |
| K4H560438E-GCB3 | 1,547 | 2007+ | 索取报价 |
| K4H560438EGCB30 | 12,000 | 索取报价 | |
| K4H560438E-GCB3 | 960 | 索取报价 | |
| K4H560438E-GCB3 | 3,706 | 索取报价 | |
| K4H560438E-GCB3 | 3,706 | 索取报价 | |
| K4H560438E-GCB3 | 5,000 | 2005+ | 索取报价 |
| K4H560438E-GCB3 | 7,680 | 2003 | 索取报价 |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| K4H560438D-GCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438DGLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-VCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-VLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-ZCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-ZCB3000 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-ZLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438EGLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438H-ZLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438HZCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |