图片仅供参考
| 制造商IC编号 | K4M561633K-BN75 |
| 厂牌 | SAMSUNG/三星 |
| IC 类别 | SDRAM MOBILE |
| IC代码 | 16MX16 SD |
| 脚位/封装 | FBGA |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.0V/3.3V |
| 温度规格 | -25 C~+85 C |
| 速度 | 133 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR |
| Generation | 12th Generation |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| K4M561633HBG-75 | FBGA | 3.0V/3.3V | 133 MHZ | -25 C~+85 C |
| K4S561633-CBN75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-FN75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-ZE75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-ZG75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-ZN75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633F-ZN75T00 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S561633G-BN75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S56163LCBG75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |
| K4S56163LF-ZE75 | FBGA | 3.3 V | 133 MHZ | -25 C~+85 C |