K4S563233FNH75
产品详情
| 脚位/封装 | TSOP2 |
| 外包装 | |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | 133 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x32 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 7th Generation |
| 脚位/封装 | TSOP2 |
| 外包装 | |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | 133 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x32 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 7th Generation |