脚位/封装 | TSOP2(54) |
外包装 | |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Max Clock Frequency | 133 MHz |
Production Status | Production |
Package Material | Lead Plating |
Product Family | SDRAM/Mobile LPSDR |
Version | Q2 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
W9825G6-75PBFREE | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6CB-75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6CH-7 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6CH75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6DH-6 AND -75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6DH75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6EH-7 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6EH-75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6EH-75/6 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
W9825G6EH-7554P | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |