脚位/封装 | TSOP2(86) |
外包装 | |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 183 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Max Clock Frequency | 200 MHz+ |
Production Status | Production |
Package Material | Lead Plating |
Product Family | SDRAM/Mobile LPSDR |
Version | A2 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
EM638325TS-5.5 | TSOP2(86) | 3.3 V | 183MHZ | 0 C~+70 C |
EM638325VF-3.5/4/5/5.5 | TSOP2(86) | 3.3 V | 183MHZ | 0 C~+70 C |
EM638325VF-5.5 | TSOP2(86) | 3.3 V | 183MHZ | 0 C~+70 C |
HY57V643220-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220BTC-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220BTC-55-A | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CLT-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CT-5.5 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CT-55 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |
HY57V643220CT-55,60 | TSOP2(86) | 3.3 V | 183 MHZ | 0 C~+70 C |