| 脚位/封装 | TSOP2(86) |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | 183 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 2M |
| Bit Organization | x32 |
| Density | 64M |
| Version | B2 |
| Max Clock Frequency | 200 MHz+ |
| Production Status | Production |
| Package Material | Pb-Free/RoHS-Plating |
| Product Family | SDRAM/Mobile LPSDR |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| HY57V643220CT-55I | TSOP2(86) | 3.3 V | 183 MHZ | -40 C~+85 C |
| HY57V643220DLTP-55I | TSOP2(86) | 3.3 V | 183 MHZ | -40 C~+85 C |
| HY57V653220BLTC-55I | TSOP2(86) | 3.3 V | 183MHZ | -40 C~+85 C |
| HY57V653220BTC-55HYNIX | TSOP2(86) | 3.3 V | 183MHZ | -40 C~+85 C |