脚位/封装 | TSOP2(54) |
外包装 | |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | -40 C~+85 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 32M |
Bit Organization | x16 |
Density | 512M |
Max Clock Frequency | 133 MHz |
Production Status | Production |
Package Material | Lead Plating |
Product Family | SDRAM/Mobile LPSDR |
Version | B2 |