| 脚位/封装 | FBGA |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 166 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 4M |
| Bit Organization | x32 |
| Density | 128M |
| Version | B2 |
| Max Clock Frequency | 167 MHz |
| Production Status | Production |
| Product Family | SDRAM/Mobile LPSDR |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| HY5V22EMP-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY5V22EMP-6-C | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B27G-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |
| MT48LC4M32B2TA-6 | FBGA | 3.3 V | 166 MHZ | 0 C~+70 C |