| 脚位/封装 | TSOP2 |
| 外包装 | |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x32 |
| Density | 256M |
| Version | DI |
| Max Clock Frequency | 167 MHz |
| Production Status | Production |
| Package Material | Pb-Free/RoHS-Plating |
| Product Family | SDRAM/Mobile LPSDR |