脚位/封装 | BGA-24 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.0 V |
温度规格 | -40 C~+85 C |
速度 | 108 MHZ |
标准包装数量 | |
标准外箱 | |
Density | 29M |
Product Series | Serial Peripheral Interface (SPI) Flash Memory |
Package Material | Low Halogen Lead (Pb)-Free |
Process Technology | 90nm, MirrorBit Technology |
Data Rate | SDR, <100 MHz |
Flash Interface | Serial (SPI) |
Simultaneous Read Write | No |
Model Number | 20 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
S25FL127SABBHIC00 | BGA-24 | 3.0 V | 108 MHZ | -40 C~+85 C |
S25FL127SABBHIT03 | BGA-24 | 3.0 V | 108 MHZ | -40 C~+85 C |
S25FL129P0XBHI300 | BGA-24 | 3.0 V | 108 MHZ | -40 C~+85 C |
S25FL129P0XBHI303 | BGA-24 | 3.0 V | 108 MHZ | -40 C~+85 C |
S25FL129P0XBHIY00 | BGA-24 | 3.0 V | 108 MHZ | -40 C~+85 C |
S25FL129P0XBHIZ03 | BGA-24 | 3.0 V | 108 MHZ | -40 C~+85 C |