脚位/封装 | TSOP2 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | 0-70C |
速度 | 143MHz |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Io | LVTTL |
Organization | 256M(16Mx16),8K |
Promos Designator | V |
Special Feature | ULTRA LOW POWER GRADE |
Cmos | C |
Rev Level | B |
Banks | 4 BANKS |
Package | 54-Ball FBGA,lead plating |
Type | SDRAM |