W971GG6JB-3
产品概述
图片仅供参考
| 制造商IC编号 | W971GG6JB-3 |
| 厂牌 | WINBOND/華邦 |
| IC 类别 | DDR2 SDRAM |
| IC代码 | 64MX16 DDR2 |
产品详情
| 脚位/封装 | FBGA-84 |
| 外包装 | |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.8 V |
| 温度规格 | 0 C~+85 C |
| 速度 | 667 MBPS |
| 标准包装数量 | |
| 标准外箱 |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| K4T1G164QE-HCE6000 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HCE60JR | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HCE6: | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HCE6T | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HCE6T00 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HCE6T000 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HCE7/E6 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HELE6 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HIE6 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |
| K4T1G164QE-HIE6000 | FBGA-84 | 1.8 V | 667 MBPS | 0 C~+85 C |