| 脚位/封装 |
TSOP-48
|
| 外包裝 |
TAPE ON REEL
|
| 無鉛/環保 |
無鉛/環保
|
| 電壓(伏) |
2.7V-3.6V
|
| 溫度規格 |
0 C~+70 C
|
| 速度 |
25 NS
|
| 標準包裝數量 |
2000
|
| 標準外箱 |
|
Description...................................................................................................................5
1.1 Product List....................................................................................................................................6
1.2 Pin description................................................................................................................................9
1.3 Functional block diagram...............................................................................................................10
1.4 Address role.................................................................................................................................11
1.5 Command Set...............................................................................................................................12
2 Bus Operations............................................................................................................................14
2.1 Command Input............................................................................................................................14
2.2 Address Input...............................................................................................................................14
2.3 Data Input....................................................................................................................................14
2.4 Data Output.................................................................................................................................14
2.5 Write Protect................................................................................................................................14
2.6 Stand-by......................................................................................................................................14
3 DEVICE OPERATION...................................................................................................................15
3.1 Page Read....................................................................................................................................15
3.2 Data Handiling Restriction During Program Sequences......................................................................15
3.3 Page Program...............................................................................................................................15
3.4 Multiple plane program..................................................................................................................16
3.5 Block Erase...................................................................................................................................16
3.6 Multiple plane Block Erase..............................................................................................................17
3.7 Copy-Back Program.......................................................................................................................17
3.8 Multiple plane copy back Program...................................................................................................18
3.9 Special read for copy back..............................................................................................................18
3.10 EDC Operation............................................................................................................................18
3.11 Read Status Register...................................................................................................................20
3.12 Read Status Enhanced.................................................................................................................20
3.13 Read Status Register field definition..............................................................................................21
3.14 Read EDC Status Register............................................................................................................21
3.15 Reset.........................................................................................................................................22
3.16 Cache Read................................................................................................................................22
3.17 Cache Program...........................................................................................................................23
3.18 Multi-plane Cache Program..........................................................................................................23
3.19 Read ID......................................................................................................................................25
3.19.1 Legacy Read ID........................................................................................................................25
3.20 Read ONFI Signature...................................................................................................................27
3.21 Read Parameter Page..................................................................................................................27
3.22 Parameter Page Data Structure Definition......................................................................................27
4 OTHER FEATURES.......................................................................................................................30
4.1 Data Protection and Power on / off sequence...................................................................................30
4.2 Ready/Busy..................................................................................................................................30
4.3 Write protect (#WP) handling........................................................................................................30
5 Device Parameters......................................................................................................................31
6 Timing Diagrams.........................................................................................................................35
7 Package Mechanical....................................................................................................................58
7.1 Power consumptions and pin capacitance for allowed stacking configurations.....................................60
8 Application notes and comments...............................................................................................61
8.1 System Interface using CE# don't care............................................................................................61
8.2 System Bad Block Replacement......................................................................................................62
8.3 Bad Block Management.................................................................................................................
