脚位/封装 | TSOP2 |
外包裝 | TRAY |
無鉛/環保 | 無鉛/環保 |
電壓(伏) | 3.3 V |
溫度規格 | normal power & industrial temp |
速度 | 133MHz 3-3-3 |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 8M |
Bit Organization | x16 |
Density | 128M |
Package Material | lead & halogen free |
Hynix Memory | H |
No Of Banks | 4 banks |
Die Generation | 8th |
Product Family | DRAM |
Product Mode | SDR |
Shipping Method | tray |