| 脚位/封装 | TSOP2(54) |
| 外包裝 | TRAY |
| 無鉛/環保 | 含鉛 |
| 電壓(伏) | 3.3 V |
| 溫度規格 | 0 C~+70 C |
| 速度 | 166 MHZ |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 16M |
| Bit Organization | x8 |
| Density | 128M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 4th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
|---|---|---|---|---|
| HY57V28420AT-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28420HCT-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820AT-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820HCT-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820HCT-H #160 #16 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820HGT-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |