脚位/封装 | TSOP |
外包裝 | TRAY |
無鉛/環保 | 含鉛 |
電壓(伏) | 3.3 V |
溫度規格 | commercial(0°C~70°C) |
速度 | 100 MHZ |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 16M |
Bit Organization | x8 |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 1st Gen. |
Shipping Method | tray |