| 脚位/封装 | TSOP2 |
| 外包裝 | TRAY |
| 無鉛/環保 | 含鉛 |
| 電壓(伏) | 3.3 V |
| 溫度規格 | |
| 速度 | PC100, CL3 |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 64M |
| Bit Organization | x4 |
| Density | 256M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 1st Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| IC 編號 | 數量 | 生產年份 | |
|---|---|---|---|
| HY57V56420T-SDR | 80,000 | 索取報價 | |
| HY57V56420T-SDR | 100 | 2001 | 索取報價 |
| HY57V56420T-SDR | 100 | 索取報價 | |
| HY57V56420T-SDR | 80,000 | 200132 | 索取報價 |
| HY57V56420T-SDR | 80,000 | 2001 | 索取報價 |
| HY57V56420T-SDR | 20,000 | 索取報價 | |
| HY57V56420T-SDR | 30,000 | 索取報價 | |
| HY57V56420T-SDR | 19,000 | 索取報價 | |
| HY57V56420T-SDR | 1,000 | 01+ | 索取報價 |
| HY57V56420T-SDR | 3,000 | 01+ | 索取報價 |