脚位/封装 | TSOP2(86) |
外包裝 | TRAY |
無鉛/環保 | 無鉛/環保 |
電壓(伏) | 3.3 V |
溫度規格 | -40 C~+85 C |
速度 | 143 MHZ |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | super low power |
Shipping Method | tray |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
K4S643232F-TI7000 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232F-TI70000 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232F-TI70T00 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232F-TP70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232FTIP70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232H-TI/P70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232H-TI70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232H-TI700 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232H-UI70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232H-UI70000 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |