脚位/封装 | TSOP2(86) |
外包裝 | TRAY |
無鉛/環保 | 含鉛 |
電壓(伏) | 3.3 V |
溫度規格 | 0 C~+70 C |
速度 | 200 MHZ |
標準包裝數量 | |
標準外箱 | |
Bit Organization | x32 |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Shipping Method | tray |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
EM638325PSA-5G | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM638325TS-5 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM638325TS-5G | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM638325TS35 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM638325TSA-5 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM638325TSA-5 DC:2010 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM638325TSA-5G | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V64322 0CT-5 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V643220CLT-5 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V643220CT #65293 | TSOP2(86) | 3.3 V | 200 MHZ | 0 C~+70 C |