HY5V26DLFP-P
產品詳情
| 脚位/封装 | FBGA |
| 外包裝 | TRAY |
| 無鉛/環保 | 無鉛/環保 |
| 電壓(伏) | 3.3 V |
| 溫度規格 | 0 C~+70 C |
| 速度 | 100MHz, CL2 |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 5th Gen. |
| Power Consumption | low power |
| Shipping Method | tray |