HY5V26FFP-H-A
產品詳情
| 脚位/封装 | FBGA |
| 外包裝 | TRAY |
| 無鉛/環保 | 含鉛 |
| 電壓(伏) | 3.3 V |
| 溫度規格 | 0 C~+70 C |
| 速度 | 133MHz, CL3 3-3-3 |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |
| 脚位/封装 | FBGA |
| 外包裝 | TRAY |
| 無鉛/環保 | 含鉛 |
| 電壓(伏) | 3.3 V |
| 溫度規格 | 0 C~+70 C |
| 速度 | 133MHz, CL3 3-3-3 |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| Shipping Method | tray |