脚位/封装 | FBGA |
外包裝 | TRAY |
無鉛/環保 | 無鉛/環保 |
電壓(伏) | 3.3 V |
溫度規格 | 0 C~+70 C |
速度 | 133MHz, CL3 3-3-3 |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 1st Gen. |
Power Consumption | normal |
Shipping Method | tray |