K4B2G0846D-HCH9
產品概述
圖片僅供參考
| 製造商IC編號 | K4B2G0846D-HCH9 |
| 廠牌 | SAMSUNG/三星 |
| IC 類別 | DDR3 SDRAM |
| IC代碼 | 256MX8 DDR3 |
| 共通IC編號 | K4B2G0846D-HCH90 |
| K4B2G0846D-HCH900 | |
| K4B2G0846D-HCH9000 | |
| K4B2G0846D-HCH9T | |
| K4B2G0846D-HCH9T00 | |
| K4B2G0846D-HCH9TCV |
產品詳情
| 脚位/封装 | FBGA-78 |
| 外包裝 | TRAY |
| 無鉛/環保 | 無鉛/環保 |
| 電壓(伏) | 1.5 V |
| 溫度規格 | 0 C~+85 C |
| 速度 | 1333 MBPS |
| 標準包裝數量 | 1280 |
| 標準外箱 | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 5th Generation |
| Power | Normal Power |
供應鏈有貨
| IC 編號 | 數量 | 生產年份 | |
|---|---|---|---|
| K4B2G0846D-HCH9 | 261 | 索取報價 | |
| K4B2G0846D-HCH9 | 2,560 | 13+ | 索取報價 |
| K4B2G0846D-HCH9 | 5,500 | 索取報價 | |
| K4B2G0846D-HCH9 | 38,847 | 索取報價 | |
| K4B2G0846D-HCH9 | 15,000 | 索取報價 | |
| K4B2G0846D-HCH9 | 185 | 1115 | 索取報價 |
| K4B2G0846D-HCH9 | 440 | 1115 | 索取報價 |
| K4B2G0846D-HCH9 | 6,000 | 14+ | 索取報價 |
| K4B2G0846D-HCH9 | 2,560 | 12+ | 索取報價 |
| K4B2G0846D-HCH9 | 11,350 | 16+ | 索取報價 |
FFFE/互通料號 (形式，腳位和功能對等)
| IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
|---|---|---|---|---|
| K4B2G0846C-HYH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C-HYH9 IC | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C-HYH9000 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C/D-B/HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C/D-HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846C/D-HCH9000 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-BCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH90S3 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HYH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HYH9 IC | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |