圖片僅供參考
| 製造商IC編號 | K4H511638G/F-LCB3 |
| 廠牌 | SAMSUNG/三星 |
| IC 類別 | DDR1 SDRAM |
| IC代碼 | 32MX16 DDR1 |
| 脚位/封装 | FBGA |
| 外包裝 | |
| 無鉛/環保 | 無鉛/環保 |
| 電壓(伏) | 2.5 V |
| 溫度規格 | 0 C~+85 C |
| 速度 | 166 MHZ |
| 標準包裝數量 | |
| 標準外箱 | |
| Number Of Words | 32M |
| Bit Organization | x16 |
| Density | 512M |
| Internal Banks | 4 Banks |
| Power | Low Power |
| Generation | 8th Generation |
| IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
|---|---|---|---|---|
| IS43R16320D-6B | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| IS43R16320E-6B | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| IS43R16320F-6B | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638F-HLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638G-HLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638G-LLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638HUCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638J-BCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638J-BCB300 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H511638J-BCB3000 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |