MT47H32M16HR-3:G

產品概述

IC Picture

圖片僅供參考

製造商IC編號 MT47H32M16HR-3:G
廠牌 MICRON/美光
IC 類別 DDR2 SDRAM
IC代碼 32MX16 DDR2
共通IC編號 MT47H32M16HR-3G

產品詳情

脚位/封装 FBGA-84
外包裝
無鉛/環保 無鉛/環保
電壓(伏) 1.8 V
溫度規格 0 C~+85 C
速度 667 MBPS
標準包裝數量
標準外箱
Number Of Words 32M
Bit Organization x16
Density 512M
Max Clock Frequency 333 MHz
Production Status Production
Product Family DDR2 SDRAM
Version H
Die Revision G

Description The DDR2 SDRAM uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls. A single read or write access for the DDR2 SDRAM effectively consists of a single 4n-bit-wide, one-clock-cycle data transfer at the internal DRAM core and four corresponding n-bitwide, one-half-clock-cycle data transfers at the I/O balls. A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. The x16 offering has two data strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS, UDQS#). The DDR2 SDRAM operates from a differential clock (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS as well as to both edges of CK. Read and write accesses to the DDR2 SDRAM are burst-oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVATE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVATE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access. The DDR2 SDRAM provides for programmable read or write burst lengths of four or eight locations. DDR2 SDRAM supports interrupting a burst read of eight with another read or a burst write of eight with another write. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access. As with standard DDR SDRAM, the pipelined, multibank architecture of DDR2 SDRAM enables concurrent operation, thereby providing high, effective bandwidth by hiding row precharge and activation time. A self refresh mode is provided, along with a power-saving, power-down mode. All inputs are compatible with the JEDEC standard for SSTL_18. All full drive-strength outputs are SSTL_18-compatible.

供應鏈有貨

IC 編號 數量 生產年份
MT47H32M16HR-3:G 807 11+ 索取報價
MT47H32M16HR-3:G 810 11+ 索取報價
MT47H32M16HR-3:G 4,000 11+ 索取報價
MT47H32M16HR-3:G 2,500 11+ 索取報價
MT47H32M16HR-3:G 6,000 11+ 索取報價
MT47H32M16HR-3:G 10,000 11+ 索取報價
MT47H32M16HR-3:G 0 索取報價
MT47H32M16HR-3:G 11,000 11+ 索取報價
MT47H32M16HR-3:G 10,000 索取報價
MT47H32M16HR-3:G 16,000 11+ 索取報價

FFFE/互通料號 (形式,腳位和功能對等)

IC 編號 脚位/封装 電壓(伏) 速度 溫度規格
EM68B16CWPA-3H FBGA-84 1.8 V 667 MBPS 0 C~+85 C
EM68B16CWPA-3H 512MB DDR2 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
EM68B16CWQC-3H FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621AF-Y4 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621AF-Y5 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621AFP-Y4 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621AFP-Y5 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621BEP-Y5 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621BFP-Y4 FBGA-84 1.8 V 667 MBPS 0 C~+85 C
HY5PS121621BFP-Y5-C FBGA-84 1.8 V 667 MBPS 0 C~+85 C