MT48LC2M32B2TG-55

AB庫存

產品概述

IC Picture

圖片僅供參考

製造商IC編號 MT48LC2M32B2TG-55
廠牌 MICRON/美光
IC 類別 SDRAM
IC代碼 2MX32 SD
共通IC編號 MT48LC2M32B2TG55
MT48LC2M32B2TG55TR

產品詳情

脚位/封装 TSOP2(86)
外包裝
無鉛/環保 含鉛
電壓(伏) 3.3 V
溫度規格 0 C~+70 C
速度 183 MHZ
標準包裝數量
標準外箱
Number Of Words 2M
Bit Organization x32
Density 64M
Max Clock Frequency 200 MHz+
Production Status Production
Package Material Lead Plating
Product Family SDRAM/Mobile LPSDR
Version B2

General Description The 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’s 67,108,864-bit banks is organized as 8192 rows by 2048 columns by 4 bits. Each of the 16,777,216-bit banks is organized as 2048 rows by 256 columns by 32 bits. Read and write accesses to the SDRAM are burst-oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA[1:0] select the bank; A[10:0] select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. The SDRAM provides for programmable read or write burst lengths (BL) of 1, 2, 4, or 8 locations, or the full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The 64Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a highspeed, fully random access. Precharging one bank while accessing one of the other three banks will hide the PRECHARGE cycles and provide seamless, high-speed, random-access operation. The 64Mb SDRAM is designed to operate in 3.3V memory systems. An auto refresh mode is provided, along with a power-saving, power-down mode. All inputs and outputs are LVTTL-compatible. SDRAM devices offer substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time, and the capability to randomly change column addresses on each clock cycle during a burst access.

庫存

IC 編號 數量 單價 (USD) 生產年份 附記
MT48LC2M32B2TG55TR 85 0320 AB庫存 索取報價

供應鏈有貨

IC 編號 數量 生產年份
MT48LC2M32B2TG55TR 10,000 17+ 索取報價
MT48LC2M32B2TG55TR 102 03+ 索取報價
MT48LC2M32B2TG55TR 111 2003 索取報價
MT48LC2M32B2TG55 2,007 索取報價
MT48LC2M32B2TG55 1,000 索取報價
MT48LC2M32B2TG55 10,000 2009+ 索取報價
MT48LC2M32B2TG55 25,880 2006+ 索取報價
MT48LC2M32B2TG55 30,000 2008+ 索取報價
MT48LC2M32B2TG55 32,868 2006+ 索取報價
MT48LC2M32B2TG55 1,000 2002+ 索取報價

FFFE/互通料號 (形式,腳位和功能對等)

IC 編號 脚位/封装 電壓(伏) 速度 溫度規格
EM638325TS-5.5 TSOP2(86) 3.3 V 183MHZ 0 C~+70 C
EM638325VF-3.5/4/5/5.5 TSOP2(86) 3.3 V 183MHZ 0 C~+70 C
EM638325VF-5.5 TSOP2(86) 3.3 V 183MHZ 0 C~+70 C
HY57V643220-55 TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C
HY57V643220BTC-55 TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C
HY57V643220BTC-55-A TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C
HY57V643220CLT-55 TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C
HY57V643220CT-5.5 TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C
HY57V643220CT-55 TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C
HY57V643220CT-55,60 TSOP2(86) 3.3 V 183 MHZ 0 C~+70 C