脚位/封装 | TSOP2(86) |
外包裝 | |
無鉛/環保 | 含鉛 |
電壓(伏) | 3.3 V |
溫度規格 | -40 C~+85 C |
速度 | 166 MHZ |
標準包裝數量 | |
標準外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Max Clock Frequency | 167 MHz |
Production Status | Production |
Package Material | Lead Plating |
Product Family | SDRAM/Mobile LPSDR |
Version | BI |
IC 編號 | 脚位/封装 | 電壓(伏) | 速度 | 溫度規格 |
---|---|---|---|---|
AS4C2M32S-6TIN | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
AS4C2M32SA-6TIN | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
AS4C2M32SA-6TINTR | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
EM638325TS-6IG | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
HY57V643220CLT-6I | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
HY57V643220CT-6HYNI | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
HY57V643220CT-6I | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
HY57V643220CT60I | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
HY57V643220DLTP-6I | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |
HY57V643220DTP-6I | TSOP2(86) | 3.3 V | 166 MHZ | -40 C~+85 C |