F59L2G81KA-25BIG2N
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | F59L2G81KA-25BIG2N |
| Hersteller | ESMT/EMP |
| Produktkategorie | FLASH-NAND |
| IC-Code | 256MX8 NAND SLC |
Produktbeschreibung
| Gehäuse | BGA-63 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 3.3 V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 25 NS |
| Standard Stückzahl | |
| Abmessungen Karton |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| S34ML02G200BHA000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML02G200BHI00 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML02G200BHI000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML02G200BHI000 SPANSION | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML02G200BHI003 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML02G300BHI00 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML02G300BHI000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| S34ML2G100BHI000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| TC58BNG1S3HBAI4 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| TC58BVG1S3HBAI4 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |