HY57V161610ETP-5
Produktbeschreibung
| Gehäuse | TSOP2(50) |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 3.3 V |
| Betriebstemperatur | 0 C~+70 C |
| Geschwindigkeit | 200 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 6th Gen. |
| No Of Banks | 2 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| HY57V161610ETP-5 | 5.000 | 2009+ | Anfrage senden |
| HY57V161610ETP-5 | 5.000 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| EM636165TS-5 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| EM636165TS5G | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V16160ET-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610DTC-5 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610DTC-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610DTC-75 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ET-5 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ET-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ETC-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ETC-75 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |