Gehäuse | stack package(hynix) |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | |
Geschwindigkeit | PC133, CL3 |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 64M |
Bit Organization | x4 |
Density | 256M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Teilenummer | Menge | Datecode | |
---|---|---|---|
HY57V56420BS-HST | 10.000 | Anfrage senden |