| Package | stack package(hynix) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | |
| Speed | PC133, CL3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 64M |
| Bit Organization | x4 |
| Density | 256M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 3rd Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V56420BS-HST | 10,000 | Get Quote |