Gehäuse | stack package(hynix) |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | commercial(0°C~70°C) |
Geschwindigkeit | 133 MHZ |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 64M |
Bit Organization | x4 |
Density | 256M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Power Consumption | low power |
Shipping Method | tray |