Package | stack package(hynix) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | commercial(0°C~70°C) |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 64M |
Bit Organization | x4 |
Density | 256M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Power Consumption | low power |
Shipping Method | tray |