| Package | stack package(hynix) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | commercial(0°C~70°C) |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 64M |
| Bit Organization | x4 |
| Density | 256M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 4th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | low power |
| Shipping Method | tray |