Gehäuse | FBGA |
Verpackung | TRAY |
RoHS | RoHS |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | commercial(0°C~70°C) |
Geschwindigkeit | 133MHz, CL3 3-3-3 |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 2nd Gen. |
Power Consumption | normal |
Shipping Method | tray |
Teilenummer | Menge | Datecode | |
---|---|---|---|
HY5V52AFP-H-C | 20.000 | 2011+ | Anfrage senden |
HY5V52AFP-H-C | 4.800 | 2008+ | Anfrage senden |
HY5V52AFP-H-C | 1.600 | 2008+ | Anfrage senden |
HY5V52AFP-H-C | 3.200 | 2008+ | Anfrage senden |
HY5V52AFP-H-C | 9.600 | Anfrage senden | |
HY5V52AFPH | 10.000 | Anfrage senden | |
HY5V52AFP-H-C | 4 | Anfrage senden | |
HY5V52AFPH | 400 | Anfrage senden | |
HY5V52AFPH | 400 | Anfrage senden | |
HY5V52AFP-H-C | 8.000 | Anfrage senden |