Package | FBGA |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | commercial(0°C~70°C) |
Speed | 133MHz, CL3 3-3-3 |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 2nd Gen. |
Power Consumption | normal |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY5V52AFP-H-C | 20,000 | 2011+ | Get Quote |
HY5V52AFP-H-C | 4,800 | 2008+ | Get Quote |
HY5V52AFP-H-C | 1,600 | 2008+ | Get Quote |
HY5V52AFP-H-C | 3,200 | 2008+ | Get Quote |
HY5V52AFP-H-C | 9,600 | Get Quote | |
HY5V52AFPH | 10,000 | Get Quote | |
HY5V52AFP-H-C | 4 | Get Quote | |
HY5V52AFPH | 400 | Get Quote | |
HY5V52AFPH | 400 | Get Quote | |
HY5V52AFP-H-C | 8,000 | Get Quote |