| Package | FBGA |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | commercial(0°C~70°C) |
| Speed | 133MHz, CL3 3-3-3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 8M |
| Bit Organization | x32 |
| Density | 256M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 2nd Gen. |
| Power Consumption | normal |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY5V52AFP-H-C | 20,000 | 2011+ | Get Quote |
| HY5V52AFP-H-C | 4,800 | 2008+ | Get Quote |
| HY5V52AFP-H-C | 1,600 | 2008+ | Get Quote |
| HY5V52AFP-H-C | 3,200 | 2008+ | Get Quote |
| HY5V52AFP-H-C | 9,600 | Get Quote | |
| HY5V52AFPH | 10,000 | Get Quote | |
| HY5V52AFP-H-C | 4 | Get Quote | |
| HY5V52AFPH | 400 | Get Quote | |
| HY5V52AFPH | 400 | Get Quote | |
| HY5V52AFP-H-C | 8,000 | Get Quote |