K4B1G0846F-HCH9
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B1G0846F-HCH9 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 128MX8 DDR3 |
| Andere Bezeichnungen | K4B1G0846F-HCH9000 |
| K4B1G0846F-HCH9T |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.35V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1333 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Internal Banks | 8 Banks |
| Generation | 7th Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B1G0846F-HCH9 | 30.000 | 2010+ | Anfrage senden |
| K4B1G0846F-HCH9 | 3.000 | Anfrage senden | |
| K4B1G0846F-HCH9 | 2.560 | 2010 | Anfrage senden |
| K4B1G0846F-HCH9 | 100.000 | 2010 | Anfrage senden |
| K4B1G0846F-HCH9 | 33.280 | Anfrage senden | |
| K4B1G0846F-HCH9 | 21.275 | Anfrage senden | |
| K4B1G0846F-HCH9 | 38.400 | Anfrage senden | |
| K4B1G0846F-HCH9000 | 60.000 | Anfrage senden | |
| K4B1G0846F-HCH9 | 10.000 | 2011+ | Anfrage senden |
| K4B1G0846F-HCH9 | 30.000 | 10+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4B1G0846C-ZCG8 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846C-ZCG9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846C-ZCH9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846CZCG7 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846D-HCF9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846D-HCH9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846D-HCH9000 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846E-HC9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846E-HCH8T | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |
| K4B1G0846E-HCH9 | FBGA-78 | 1.35V | 1333 MBPS | 0 C~+85 C |