K4B2G0846C-HCH9
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G0846C-HCH9 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 256MX8 DDR3 |
| Andere Bezeichnungen | K4B2G0846C-HCH9000 |
| K4B2G0846C-HCH9T00 |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1333 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 4th Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G0846C-HCH9 | 10.788 | Anfrage senden | |
| K4B2G0846C-HCH9 | 12.800 | Anfrage senden | |
| K4B2G0846C-HCH9 | 2.500 | 2011 | Anfrage senden |
| K4B2G0846C-HCH9T00 | 1.280 | 11+ | Anfrage senden |
| K4B2G0846C-HCH9T00 | 30.000 | Anfrage senden | |
| K4B2G0846C-HCH9000 | 8.960 | Anfrage senden | |
| K4B2G0846C-HCH9 | 1.139 | 2011+ | Anfrage senden |
| K4B2G0846C-HCH9 | 7.680 | 12+ | Anfrage senden |
| K4B2G0846C-HCH9 | 10.240 | 12+ | Anfrage senden |
| K4B2G0846C-HCH9 | 0 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H5TQ2G83CFR-H9C 49600EA | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| H5TQ2G83CFR-H9C NBSP | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| H5TQ2G83DFR-H9CR | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| H5TQ2G83FFR-H9CR | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| HXB15H2G800CF-15H | FBGA-78 | 1.5V | 1333 MBPS | 0 C~+85 C |
| IS43TR82560A-15HBL | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| IS43TR82560B-15HBL | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| IS43TR82560B-15HBL-TR | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| IS43TR82560B-15HBLC | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| IS43TR82560C-15HBL | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |