Bilder dienen nur der Illustration
Hersteller-Nummer | K4G80325FB-HC28000(8G DDR5) |
Hersteller | SAMSUNG |
Produktkategorie | GDDR5 SDRAM |
IC-Code | 256MX32 GDDR5 |
Gehäuse | FBGA-170 |
Verpackung | |
RoHS | RoHS |
Spannungsversorgung | 1.35V/1.5V |
Betriebstemperatur | 0 C~+85 C |
Geschwindigkeit | 8.0 GBPS |
Standard Stückzahl | |
Abmessungen Karton | |
Bit Organization | x32 |
Internal Banks | 16 Banks |
Generation | 3rd Generation |
Power | Normal Power |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
K4G80325FB-HC | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC03 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC22 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC24 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC25 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC25000 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC25T00 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC28 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC28 D5 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
K4G80325FB-HC28 D5 25 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |