K4H510838G-HCB3
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4H510838G-HCB3 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR1 SDRAM |
| IC-Code | 64MX8 DDR1 |
| Andere Bezeichnungen | K4H510838G-HCB3T00 |
| K4H510838G-HCB3TCV |
Produktbeschreibung
| Gehäuse | FBGA-60 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 2.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 166 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 64M |
| Bit Organization | x8 |
| Density | 512M |
| Internal Banks | 4 Banks |
| Generation | 8th Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4H510838G-HCB3 | 4.000 | Anfrage senden | |
| K4H510838G-HCB3 | 20 | 1031 | Anfrage senden |
| K4H510838G-HCB3 | 2.000 | Anfrage senden | |
| K4H510838G-HCB3 | 2.000 | 2010+ | Anfrage senden |
| K4H510838G-HCB3 | 20.000 | Anfrage senden | |
| K4H510838G-HCB3 | 2.000 | Anfrage senden | |
| K4H510838G-HCB3 | 10.000 | Anfrage senden | |
| K4H510838G-HCB3 | 60.000 | 09+ | Anfrage senden |
| K4H510838G-HCB3 | 1.120 | 2010+ | Anfrage senden |
| K4H510838G-HCB3TCV | 30.000 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4H510838CZCB3T00 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838D-ZCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838D-ZCB3T | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838D-ZCB3T00 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838D-ZLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838F-HCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838F-HCB3T | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838F-HLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838G-HCCC/B3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H510838G-HLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |