图片仅供参考
制造商IC编号 | K4H510838G-HCB3 |
厂牌 | SAMSUNG/三星 |
IC 类别 | DDR1 SDRAM |
IC代码 | 64MX8 DDR1 |
共通IC编号 | K4H510838G-HCB3T00 |
K4H510838G-HCB3TCV |
脚位/封装 | FBGA-60 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 2.5 V |
温度规格 | 0 C~+85 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 64M |
Bit Organization | x8 |
Density | 512M |
Internal Banks | 4 Banks |
Generation | 8th Generation |
Power | Normal Power |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
K4H510838G-HCB3 | 4,000 | 索取报价 | |
K4H510838G-HCB3 | 20 | 1031 | 索取报价 |
K4H510838G-HCB3 | 2,000 | 索取报价 | |
K4H510838G-HCB3 | 2,000 | 2010+ | 索取报价 |
K4H510838G-HCB3 | 20,000 | 索取报价 | |
K4H510838G-HCB3 | 2,000 | 索取报价 | |
K4H510838G-HCB3 | 10,000 | 索取报价 | |
K4H510838G-HCB3 | 60,000 | 09+ | 索取报价 |
K4H510838G-HCB3 | 1,120 | 2010+ | 索取报价 |
K4H510838G-HCB3TCV | 30,000 | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
K4H510838CZCB3T00 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838D-ZCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838D-ZCB3T | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838D-ZCB3T00 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838D-ZLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838F-HCB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838F-HCB3T | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838F-HLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838G-HCCC/B3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |
K4H510838G-HLB3 | FBGA-60 | 2.5 V | 166 MHZ | 0 C~+85 C |