K4H510838J-BIB3
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4H510838J-BIB3 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR1 SDRAM |
| IC-Code | 64MX8 DDR1 |
Produktbeschreibung
| Gehäuse | TSOP2(66) |
| Verpackung | |
| RoHS | Leaded |
| Spannungsversorgung | 2.5 V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 166 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 64M |
| Bit Organization | x8 |
| Density | 512M |
| Internal Banks | 4 Banks |
| Generation | 11th Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4H510838J-BIB3 | 4.000 | Anfrage senden | |
| K4H510838J-BIB3 | 2.000 | 2010+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| IS46R86400D-6TLA1 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| IS46R86400D-6TLA1-BM | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| IS46R86400D-6TLA1-TR | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| IS46R86400E-6TLA1 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H510838D-UIB3 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H510838D-UPB3 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H510838J-BPB3 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H510838J-LIB3 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H510838J-LPB3 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H510838JBIB0 | TSOP2(66) | 2.5 V | 166 MHZ | -40 C~+85 C |