K4H511638J-BPB3
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4H511638J-BPB3 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR1 SDRAM |
| IC-Code | 32MX16 DDR1 |
Produktbeschreibung
| Gehäuse | FBGA |
| Verpackung | |
| RoHS | Leaded |
| Spannungsversorgung | 2.5 V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 166 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 32M |
| Bit Organization | x16 |
| Density | 512M |
| Internal Banks | 4 Banks |
| Generation | 11th Generation |
| Power | Low Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4H511638J-BPB3 | 2.000 | 2010+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H5DU5162EFR-J3I | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| IS43R16320F-6BI | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638F-HIB3 | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638F-HIB3000 | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638F-HIB3T000 | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638G-HIB3 | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638G-HIB3TCV | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638J-BCIB3 | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |
| K4H511638J-BIB3 | FBGA | 2.5 V | 166 MHZ | -40 C~+85 C |